Scope of application
Suitable for Sapphire / glass / ceramic precision cutting, FPC / PCB precision cutting and drilling, and all kinds of metal and non-metal thin sheet precision cutting
Performance characteristics
￭355nm UV laser, 532nm green laser, 1064nm nanosecond laser and 1064nm picosecond laser can be configured to meet the needs of different materials and different processing technologies
￭Fully closure cabinet ensures the safety of operator during laser processing
￭Marble base equipped with linear motor and CCD positioning to ensure positioning accuracy of XY axis ±2um
￭Scanning peed up to 8000mm / s, which will realize high production capacity
￭Open interface can meet all kinds of automation requirements through secondary development or hardware expansion
Technical Reference
| Model No. | CY-JC | |
| Laser Power | Optional | |
| Laser Mode | Optional | |
| Laser wavelength | 355nm/532nm/1064nm/10600nm Optional | |
| Processing Scale | 600*500mm/300*300mm | |
| Processing Speed | fixed laser output:1~800mm/s; scanning laser output: 30~8000mm/s |
|
| Cooling Type | air cooling or water cooling | |
| Power Supply | AC220V 15A single phase | |
| Shield Gas | Nitrogen/Argon/CO2/compressed air | |
| Power Consumption | <1.5KW | |
| Outer Dimensions | 1800*1750*1810mm or1500*1700*1500mm | |
| Work Environment | Temperature 10℃`35℃,Humidity 5%~75% | |
