Scope of application
Suitable for laser marking on various metal or non-metal flat saurface and dimensional surface.
It is widely used for laser marking on mobile phones , computer peripheral products, circuit board, medical devices, dies, 3C electronics, automotive parts, electronic communications and etc.
Performance characteristics
￭ Unique dynamic optical optimization design and software automatic compensation can improve the processing efficiency by more than 15% compared with similar equipment
￭ The imported core components ensures the stability of the equipment and the long life of the laser source
￭ All the control boards and software are independently developed with open port for different needs of customers, and the expansion functions can be customized
￭ The independently developed 3D dynamic marking software brings small distortion of surface mapping, which can automatically map and directly edit graphics on 3D surfaces
Technical Reference
| Model | CY-M30F-3D | CY-M50F-3D | CY-M100F-3D |
| Power | 30W | 50W | 100W |
| Laser wavelength | 1064nm | ||
| Pulse frequency | 30-500KHZ | ||
| Scope of compliance | 100*100m-600*600mm optional | ||
| Minimum line width | 0.03mm | ||
| Carving line speed | 350charactor/s@200*200mm | ||
| Working deflection angle | +-11.25° | ||
| Repeat marking accuracy | 8urad | ||
| The power consumption of the whole machine | 500w-1500w | ||
| Dimensions | 982mm*650mm*1620mm | ||
| Power supply | Single phase AC220v 15A single phase | ||
| Cooling method | Air cooling/water cooling | ||
| Environmental requirements | Temperature 10~35, humidity 5%~75%, To |
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